磁控溅射TiCN薄膜对Al-Cu-Mg-Ag合金组织与性能的影响
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TG178

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国家自然科学基金资助项目(51601053);河北省高等学校科学技术研究项目(ZD2018213);邯郸市科技计划项目(19422111008-20)


Effect of Magnetron Sputtering TiCN Film on the Microstructure and Properties of Al-Cu-Mg-Ag Alloy
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    摘要:

    基于正交试验设计,在铝合金表面磁控溅射沉积TiCN薄膜,采用盐雾腐蚀、电化学腐蚀、硬度测试等探究磁控溅射工艺参数(钛靶功率、碳靶功率、氮氩比)对Al-Cu-Mg-Ag合金硬度与抗腐蚀性能的影响规律,并结合扫描电镜(SEM)、X射线衍射(XRD)等对其机理进行探讨。结果表明:磁控溅射工艺参数对合金的膜层硬度、盐雾最大腐蚀深度、腐蚀电流密度、膜基结合力的影响顺序分别为:氮氩比>C靶功率>Ti靶功率;C靶功率>氮氩比>Ti靶功率;C靶功率>氮氩比>Ti靶功率;Ti靶功率>C靶功率=氮氩比。C靶功率200 W、Ti靶功率100 W、氮氩比为1:40时,可以获得耐蚀性、硬度和膜基结合力综合性能优良的TiCN膜层。

    Abstract:

    Based on the orthogonal experimental design, TiCN films were deposited by magnetron sputtering on the surface of aluminum alloy. The effects of the magnetron sputtering process parameters (titanium target power, carbon target power, nitrogen to argon ratio) on the hardness and corrosion resistance of Al-Cu-Mg-Ag alloy were investigated by using salt spray corrosion, electrochemical corrosion and hardness test. The mechanism was investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The results show that the effects of magnetron sputtering parameters on the hardness of the alloy film, the maximum corrosion depth of salt spray, the corrosion current density and the adhesion of membrane and substrate of the film are in the following order:N2/Ar > C target power > Ti target power; C target power > N2/Ar > Ti target power; C target power > N2/Ar > Ti target power; and Ti target power > C target power=N2/Ar. When the power of C target is 200 W, the power of Ti target is 100 W, and the nitrogen to argon ratio is 1:40, TiCN films with excellent corrosion resistance, hardness and adhesion of membrane and substrate can be obtained.

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王艳琴,刘晓艳,杨鸿儒,张园,朱晓松.磁控溅射TiCN薄膜对Al-Cu-Mg-Ag合金组织与性能的影响[J].河北工程大学自然版,2022,(2):100-105

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  • 收稿日期:2022-01-16
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  • 在线发布日期: 2022-06-30
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